Plating Tungsten Process

Plating Tungsten Process

Plating Tungsten Process is a process which is to plat tungsten on the steel material or metal surface. Metal tungsten has a high melting point, strength, hardness and good chemical stability, but because its processing production is difficult and expensive, what's more, it is not economic to use it in the manufacture of larger components directly. However, it can greatly improve the service life of steel materials and enlarge the using range of steel material if steel material can be combined with good plating layer and matrix metal tungsten layer on its surface, and make full use of tungsten metal abrasive resistance, corrosion resistance and high temperature resistant characteristics. It would be very cost-effective. The main method is electroplating, vapor deposition, ion implantation, spraying, sol-gel method, etc. Although these methods have their advantages under certain conditions, electroplating is more promising.

Plating Tungsten Process Conditions

Tungsten nucleation on heat-resistant steel substrate is more difficult than on the copper and molybdenum, which indicate that temperature of tungsten layer in plating tungsten process is higher than copper and molybdenum.
1. Under atmospheric conditions, the molar ratio of molten salt is Na2WO4ZnOWO3-622, temperatures are different, molybdenum substrate is more than 850℃, copper substrate is above 870℃, heat-resistant steel substrate is more than 890℃.
2. After adding fused salt, plating workpiece must be first passed reverse current and then passed forward current to ensure forming a diffusion membrane.