GC Ejecting Needles

GC ejecting needles are mainly applied to LED chip sorting machine and semiconductor IC die bonding for assembly process.

Applications:
1.GC ejecting needles are made of BeCu alloy material, whose inherent characteristics include high hardness, mechanical strength and low degree of wearing that make it suitable to be processed to ejecting needles.
2.The GC ejecting needles are specifically produced by Chinatungsten Online and are mainly used in LED chip sorting and semiconductor IC die bonding processes for preventing push-up damage to the chip bottom side.
3.Depends on variant die dimension and aspect ratio, the requested spec of tip radius and structure design is changed accordingly.

GC ejecting needles photoGC ejecting needles photo

Main Specifications

Main Specifications

Parameter

Parameter

Parameter

Diameter

0.7 mm (+/- 0.05 mm)

Standard

Length

12-17 mm (+/- 0.05 mm)

Customized

Taping Angle

10 degree (+/- 1 degree)

Customized

Tip Radius R

12-300 um

Customized

Product Specifications

(1) Rounding type

Main Specifications

Length
(mm)

Diameter
(mm)

Taping angle
(degree)

Tip Radius
(μm)

17

0.7

8

2

17

0.7

10

12

17

0.7

10

15

17

0.7

10

20

17

0.7

10

22

12

0.7

10

23

17

0.7

10

25

17

0.7

10

30

17

0.7

10

35

17

0.7

10

40

17

0.7

10

50

12

0.7

10

50

17

0.7

10

60

17

0.7

10

70

17

0.7

10

75

17

0.7

10

100

12

0.7

10

100

17

0.7

15

22

30

0.7

15

30

(2) Top-flat type

Main Specifications

Length
(mm)

Diameter
(mm)

Taping angle
(degree)

Top-flat
Ø(um)

32

0.5

10

20

17

0.7

10

16

17

0.7

10

20

12

0.7

10

23

17

0.7

10

30

17

0.7

10

50

17

0.7

10

100

12

0.7

10

100

17

0.7

10

125

17

0.7

10

150

17

0.7

10

175

17

0.7

10

200

17

0.7

10

250

If there is any interest in tungsten products, please feel free to contact us through the following methods.
Email: sales@chinatungsten.com
Tel.: +86 592 512 9696/+86 592 512 9595/+86 592 512 7878
Fax:+86 592 512 9797

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