Ejecting Needles
Sorting and die bonding technologies are the key processes in LED chip production and semiconductor IC assembly. While, ejecting needles are necessary and significant for dies releasing from tapes without damage. During LED chip sorting and semiconductor IC die bonding assembly processes, the ejecting needles are necessary to be utilized for pushing dies up, releasing from tapes and transfer to further process by vacuum tips.
Chinatungsten Online is able to provide variant kinds of ejecting needles with variant materials and different specifications as resulted from the change in die dimension and aspect ratio and special concern of without damaging to the dies. We are specialized in product development and quality control to ensure fulfilling customer demands. We provide these needles always with the belief of "Quality First" and obey ISO 9001 quality management system for customer satisfaction.
Materials of ejecting needles
1. Pure tungsten
2. Tungsten-rhenium alloy
3. Tungsten carbide alloy
4. GC alloy
5. Plastic
If there is any interest in tungsten products, please feel free to contact us through the following methods.
Email: sales@chinatungsten.com
Tel.: +86 592 512 9696/+86 592 512 9595/+86 592 512 7878
Fax:+86 592 512 9797
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