CTIA's Tungsten Heater in Chip Manufacturing
CTIA’s tungsten heater, as a resistive tungsten heating element in chip manufacturing, is fabricated from high-purity tungsten wire or doped tungsten wire through precision processing and surface treatment processes. The tungsten heating elements are specifically designed for substrate heating and thermal zone control within Plasma Enhanced Chemical Vapor Deposition (PECVD), Physical Vapor Deposition (PVD), and Chemical Vapor Deposition (CVD) systems.
Chip manufacturing requires heating systems that can operate reliably under high vacuum, plasma exposure, and repeated high-temperature cycling. CTIA's tungsten heater offers the following technical advantages:
(1) High temperature resistance: With a melting point of about 3410℃, tungsten maintains structural integrity in high-temperature environments, making it suitable for continuous, long-term heating conditions.
(2) Low contamination: Low vapor pressure in vacuum and reactive atmospheres minimizes contamination risks from material volatilization, helping to uphold stringent process cleanliness.
(3) Uniform thermal field: Stable resistive performance ensures consistent conversion of electrical energy into thermal energy, establishing a steady temperature distribution via radiant heat transfer.
(4) Dimensional stability: A low coefficient of thermal expansion results in minimal structural deformation during frequent thermal cycling, which is essential for improving process repeatability and consistency.
CTIA GROUP provides multiple tungsten heater specifications for chip manufacturing equipment:
(1) Material: Tungsten wire or doped tungsten wire with purity ≥99.95%
(2) Wire diameter: 0.2~1.2 mm, customizable
(3) Structure: Single strand or multi-strand twisted
(4) Shape: Straight bar, coil, U-frame, hump (single peak or double peak), funnel, and customized geometries
(5) Surface: Electrolytic polishing or alkaline cleaning
Tungsten heater is mainly used in substrate heating systems and temperature control modules of PECVD, PVD, and CVD equipment. It provides a stable thermal environment for semiconductor thin film deposition, dielectric layer preparation, conductive layer deposition, and functional film formation, serving as an essential heat source for film uniformity.
CTIA GROUP has long specialized in tungsten heater manufacturing. Drawing on extensive expertise in chamber structure, thermal field distribution, and process parameters of chip manufacturing equipment, we provides highly optimized solutions. Services cover the full range from material selection to structural design, including wire specification selection, structural configuration, effective heating length, lead arrangement, suitable surface treatments, and comprehensive customization.
For any inquiry, please contact tungsten heater manufacturer: CTIA GROUP
Email: sales@chinatungsten.com
Tel: 0086 592 5129696 / 0086 592 5129595
Website: www.tungsten.com.cn
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1.Tungsten heater quotation table
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